Wafer level – heights measurement

Automated, fast, robust and accurate

Wafer-level inspection requires measurement at thousands of sites. To ensure the wafer process flow, fast measurement rate is a necessity. With its instantaneous non-scanning acquisition, DHM® is therefore the perfect tool for wafer-level quality control. This application shows structures height automated measurements with sub-nanometer vertical resolution.

 

Description

  • Material:
  • 4” bis 12” Wafer
  • Typical Height Tolerance Threshold: 10 nanometers
  • Automated Process
    • Wafer centering
    • Measurement according to sites map
    • 3D topography analysis
    • Structure height determination
    • Automated OK/NOK decision and reporting
  • Instrument:
    • Lensless DHM® – magnification 1x
    • XYZ Motorized stage
  • Software: customized user interface for wafer programmed using the Software Development Kit (SDK)
  • Typical measurement rate: 3 sites per second
  • Material:
  • 4” to 12” diameter wafer
  • Typical Height Tolerance Threshold: 10 nanometers
  • Automated Process
    • Wafer centering
    • Measurement according to sites map
    • 3D topography analysis
    • Structure height determination
    • Automated OK/NOK decision and reporting

Instrument:

  • Lensless DHM® – magnification 1x
  • XYZ Motorized stage
  • Software: customized user interface for wafer programmed using the Software Development Kit (SDK)
  • Typical measurement rate: 3 sites per second

Automated lens-less sensor for wafer inspection
Example of 3D topography measurement at a site of a wafer
Software interface for automated wafer inspection. Green circles indicates measurement sites fulfilling specification. Red ones indicates measurement sites out of specifications. Histogram on the upper right shows structure heights statistical distribution. Values of each individual site can be accessed on the lower left panel. Data can be exported for additional analysis.