Holographic MEMS Analyzer

Explore the wealth of 4D

The holographic MEMS analyzer solution provides time sequences of the successive 3D topographies of a MEMS along its driving signal. This unique set of data contains an unrivalled wealth of information. In particular, in- and out-of-plane displacements and frequency response can be analyzed at any location within the measurement field of view.

  • A non-scanning method for reduced characterization time
  • Efficient comparison between simulations and micro-manufactured devices
  • Measurement of samples that cannot be characterized with other techniques.

Record time-sequence of 3D topographies up to 25 MHz

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A Unique set of Data
for MEMS Analysis

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At Any Location

Measure at any location without scanning

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Fast & Efficient Analysis

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Up to 1000 data points per profile cut

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Compare multiple devices


Decorrelate In- & Out-of-plane displacement for any geometry

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With a single instrument


The Lyncée Tec holographic MEMS analyzer includes a complete characterization environment including:

  • Platforms for sample probing
  • Vacuum and thermal chambers
  • Signal generator for MEMS with excitation up to 25 MHz
  • Recording of electrical response
  • DHM® T and R series for the 3D topography time sequence acquisition
  • Stroboscopic unit for measurement and MEMS excitation synchronization
Wafer probing under the DHM®


The MEMSTool software enables efficient analysis of 3D topography time-sequences in term of

  • Out-of-plane displacement from 5 pm to 50 microns
  • In-plane displacement from 1 nm (sub-pixel algorithms) to 5 mm
  • Bode and Fourier frequency response analysis
  • Vibration maps
Bode diagram

Interact with your sample

Holographic MEMS Analyser

Users Testimonials

University Autonome of Barcelona

An international team of researchers from Spain, the Netherlands, and USA have characterized the flexoelectric coefficient of dielectric materials on silicon by measuring the bending radius induced on application of voltage, with the DHM®. Nature publication

Nature Nanotechnology 11, 263–266 (2016) doi:10.1038/nnano.2015.260

The DHM, unlike a vibrometer, directly measures the out of plane displacement induced at each point of a MEMS structure during a vibrational excitation .
Thus, the DHM data lends itself elegantly to harmonic analysis via the application of discrete Fourier transform techniques. The latter is indispensable to distinguish between a response that scales linearly with the applied electric field (for example, piezoelectric strains) and a response that scales quadratically with the applied electric field (for example, electrostictive strains).

Dr. Umesh Kumar, first author

FHG-IPMS in Dresden, and TU Cottbus Senftenberg

German researchers from FHG-IPMS in Dresden, and TU Cottbus Senftenberg have measured the deflection of a revolutionary micro-actuator technology using DHM® (IPMS-FHG press release). Nature publicationElectronic Component News 

Nature Communications 6, Article number: 10078 (2015)

We can work with any dynamics we want (stroboscopic and continuous measurement) – that makes the DMH unique to alternative tools (WLI and Laser-Doppler-Vibrometer).
It gives the high vertical resolution to precisely characterize the actuator out of plane deflection

Conrad Holger, first author

A vibrometer measures a velocity using the Doppler effect: tip deflection is calculated by an integration. Consequently, position measurement errors are also integrated, preventing absolute prosition and long term drift measurements.
DHM® doesn’t suffer from this problem as it measures directly a position. Deflection can be measured accurately for any time scale.

Dr. Matthieu Gaudet

Holographic MEMS Analyzer

The Holographic MEMS Analyzer solution encompasses all the options to provide you with a complete environment for MEMS characterization. The system responds to most users characterization needs, however if something is missing, Lyncée Tec is also pleased to provide you with turnkey customized solutions.


MEMS probing platforms enable direct DHM® characterization of devices without wire-bonding. A heated version enables the investigation of the effects on MEMS responses of temperatures up to 200°C.

Vacuum and temperature control

Vacuum & thermal chambers enable characterization of devices in real conditions of use, e.g. vacuum, liquids, gas, high and low temperature, down to 196°C, high pressure, etc. Measurements are as simple as in ambient conditions thanks to DHM® unique optical configuration.

Holographic Microscopes

Reflection and transmission DHM® with one and two wavelengths are fully compatible with the Holographic  MEMS Analyzer solution. They can be configured with any objective, including long working distances, immersion, and glass corrected models, for measuring in presence of probes, in liquid, and through transparent covers respectively.

Stroboscopic Module

The stroboscopic unit synchronizes the MEMS excitation with the 3D  topography time sequence and electrical response measurements. is recorded to get 3D topographies time sequences along the excitation of the MEMS, vibration and electrical information in a single data set with one system.

Post-analysis software

The MEMS Analysis Tool software enables movement decomposition in terms of tilt, deformation, in- and out-of-plane displacements. Vibration amplitude, speed and acceleration at any location of the sample can then be calculated. Moreover, this software enables resonance, Fourier, and Bode frequency analysis.

Competitive strengths

Holographic MEMS Analyzer overcomes limitations of  usual MEMS analyzers.  It is the only solution able to synchronize MEMS excitation and 3D topography measurement at frequencies up to 25 MHz. Moreover, it is ideal to measure in any environmental condition. Alternative systems are :

Holographic MEMS Analyzer vs Laser Doppler Vibrometer (LDV & 3D LDV)

The main difference between both systems is that the DHM® retrieves simultaneously data points on each pixel on the entire field of view while LDV scans the surface point by point. Therefore LDV lateral resolution is limited by the spot size (few microns). With DHM® you can select the lateral resolution adapted to your sample by choosing the appropriated objective. LDV has to perform a complex chain of signal processing steps to measure a velocity. Each data point is then converted in term of vibration amplitude. LDV alone does not provide an absolute position and thus no 3D topography. DHM® measures a time sequence of successive 3D topographies what enables direct calculation of absolute position, speed and acceleration. Vibrations amplitude can be determine with high reliability by DHM®.

Features DHM® 3D LDV LDV
Dynamic topography
3D vibrations (X,Y,Z)  XYZ  XYZ Z only
Maximum frequency 25 MHz 25 MHz up to 1.2 GHz
Full field measurement  with XY scanning with XY scanning
Diffraction limited resolution limited by laser spot size limited by laser spot size
Objective turret
No need of sample preparation diffusive sample required
Measurement of complex structures
Measurement of complex motions (simultaneous in-, out- of plane, tilt, … ) ++
Measurement of in-plane displacement lager than MEMS structures


Holographic MEMS Analyzer vs 2D Stroboscopic Microscopy

2D stroboscopic microscope is usually combined with LDV to add in-plane displacement measurement capabilities to vibrometer.

Features DHM® 2D Stroboscopic Microscopy
3D topography
3D vibrations (X,Y,Z) 1
Maximum frequency 25 MHz 1 MHz
Full field measurement

1. Only X,Y vibrations

Holographic MEMS Analyzer vs White Light Interferometer (WLI)

Some white light interferometers can perform a stroboscopic acquisition to measure MEMS dynamic topography. However, measurements of dynamic sample with a scanning technology are sensitive to environmental noise, i.e. vibrations, and are time consuming. Some systems combine white light interferometer with LDV or 2D stroboscopic acquisition in order to measure a static topography. In this case measurements of topography in environmental chamber face usual limitations of WLI technology.

Features DHM® WLI
Dynamic topography 1
3D vibrations (X,Y,Z) 1
Maximum frequency 25 MHz 1 MHz
Stitching measurement not in stroboscopic mode
Measurement in environmental chamber 2

1. WLI are usually used for static topography. Scanning technologies are not adapted to dynamic measurement 2. Limited choice of objective with window (glass) compensation


Optical measurement unit Reflection DHM® or Transmission DHM®
MEMS excitation unit LyncéeTec stroboscopic module
XYZ stage Manual or motorized stage
Software Koala for acquisition and live analysis MEMS Analysis Tool for advanced post-analysis
Objective Turret with 6 positions, magnification from 2.5x to 100x
In-plane vibration2 from 10 nm to 5 mm
Out-of-plane vibrations2 from 10 pm to 75 μm
Topography resolution Vertical : 0.3 nm Lateral1 : from 400nm to 8.5μm
Excitation frequency from static to 25 Mhz
Laser pulse length down to 7.5 ns
Max vertical velocity2 up to 10 m/s

1. equivalent to vibrometer spot size, objective dependent 2. specification does not depend on excitation frequency

Lyncée Tec Challenge 2022

Lyncée Tec Challenge 2022 was successfully launched in May 2022 to call for the best MEMS application which demonstrates the DHM® unique strengths for vibration map measurements. The winner receives a DHM® holographic MEMS analyzer as their prize! After more than 6 months, Silicon Austria Labs SAL won this award for their outstanding and innovative demonstration of measuring dynamic deformations of MEMS mirrors at all scanning angles using DHM’s unique full field vibration mode shape analysis. Congratulations to the winner and to all participants!

For more details, please visit webpage: https://challenge.lynceetec.com/

Among all applications, 5 best measurements are shown below.

Lyncée Tec CEO, Dr. Yves Emery, awarded Dr. Clement Fleury from SAL at IEEE MEMS 2023, Germany. The results were presented jointly at Lyncée Tec booth.
  • Description: Dynamic deformation of a MEMS mirror during the full scanning cycle and the corresponding point spread function
  • Sample: MEMS micromirror
  • Courtesy of: Dr. Clement Fleury, Silicon Austria Labs, Austria
Dynamic deformation of a MEMS mirror during the full scanning cycle and the corresponding point spread function
  • Description: Vibration mode shapes vs. FEM simulation
  • Sample: X-ray detector array with bismuth absorbers coating for space telescopes
  • Courtesy of: Dr. Henk van Weers, SRON, Netherlands Institute for Space Research, Netherlands
Vibration mode shape of a X-ray detector array with bismuth absorbers coating versus the FEM simulation result
  • Description: Vibration amplitude maps with frequency continuous sweep:640-670 kHz, showing complex mode shapes
  • Sample: Nano-Micro cantilever with increased sensitivity
  • Courtesy of: Prof. Dr.-Ing. Julia Körner, Leibniz University Hannover, Germany
Vibration amplitude maps of a nano-micro cantilever with frequency continuous sweep:640-670 kHz, showing complex mode shapes
  • Description: Deformed structure requires decorrelation of in- & out of plane vibration for true value
  • Sample: Tunable ring resonator
  • Courtesy of: Dr. Mathieu Gratuze, Ecole de Technologie Superieure, Canada
Deformed structure requires decorrelation of in- & out of plane vibration for true value
  • Description: Complex structures and complex in- & out-of-plane vibration mode shapes
  • Sample: Double side clamped beam
  • Courtesy of: Dr. Daniel Moreno, Ecole polytechnique fédérale de lausanne EPFL, Switzerland
Complex in- & out-of-plane vibration mode shapes of a double side clamped beam