Silicon ingots are sliced into wafers using diamond wires. Small deviation of these wires during the sawing process may results in relatively deep marks that make the wafer fragile. This application describes such defect inspection on solar wafers.
Speed is a key requirement for this application, and the unrivaled acquisition speed of DHM® is a necessity:
This application demonstrates automated defects detection over the entire surface of a semi-transparent microshell. The sample is hold by a small vacuum nozzle. Two rotation axes allow to cover its entire surface. Defects are detected and their geometrical characteristics measured. DHM® has been chosen among other techniques for this application considering:
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